PLASMA CVD & ETCHING SYSTEMS

MODEL DRIE-1000

A High Quality Plasma Deposition & Etch System, Ideal for R&D and Small Scale Production.

Modified designs with capabilities of 12" wafers.
Substrate heating to 500 C.
Top loading / Optional loadlock.
Multifunctional plasma network.
Diversified pumping configurations.
Variable electrode spacing.
Customized features and components for specific applications.

See updated photos of DRIE-1100 system.

INTRODUCTION

The Tek-Vac DRIE-1000 is constructed of the finest quality components, designed and fabricated for many years of trouble-free usage. The system is constructed of type 304 electropolished stainless steel. Capabilities of both deposition and etching are applicable to this design. Aluminum chambers are available.

The chamber size for the standard six inch wafer design is 12" dia. x 8" high. Multiple 1.5" feedthrough ports encompass the chamber. Opposing ports are sighted through the center of the plasma region. These ports have potential uses for end-point detection, UV spectroscopy, and various other plasma diagnostic techniques.

The standard pump package consists of two-stage, rotary vane mechanical pumps and a 4" expanded high speed diffusion pump. Under normal operations, one mechanical pump serves as a roughing and backing pump, while the other functions as a process gas pump. Options for a roots blower, a turbomolecular pump, a cryogenic pump, and corrosive series mechanical pumps are available.

The substrate platen is constructed of type 316 stainless steel. The platen is capable of heating to 500 C. A single 6" or smaller wafer may be accommodated in our standard model. Two blind tapped holes are provided for substrate platen fixturing or for the attachment of different materials to the platen.

The DRIE-1000 features four distinct modes of operation for complete research and development control. These modes include: RF with blocking DC capacitor, RF with plasma bias equalization, DC glow discharge, and RF plus DC.

The grounded counterelectrode can be adjusted from ½" to 3". Adjustment is accomplished from outside of the vacuum system, even while the process is occurring.

All instrumentation is contained in a 19" wide, caster mounted console. A flexible umbilical cord connects this console to the process unit, allowing easy access for maintenance and offering the ability to adjust the positioning of the console for experimental convenience purposes.

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